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YS-F22B is an ultrafine high dispersion halogen-free flame retardant with excellent high-temperature resistance and solvent resistance. Its ultrafine particle size (D95≤10um) ensures high dispersion performance in various resin and organic solvent systems. Possesses excellent high-temperature resistance with a decomposition temperature exceeding 300℃.
The values listed in the following table are typical values measured by test specification and are for reference only.
III. Product Feature
1. Eco-friendly and halogen-free.
2. High dispersibility, easily dispersible in organic solvents.
3. Excellent electrical and thermal performance.
4. More uniform coating, smoother surface.
5. Solvent resistant, non-migrating
1. YS-F22B is stored in a 25kg paper bag lined with polyethylene.
2. Temperature during storage and transportation should not exceed 80°C.
3. The product should be stored in a dry place at room temperature.
4. When stored under the above conditions, the minimum shelf life is 24 months from the date of shipment.
V. Application
YS-F22B is especially suitable for flexible copper-clad laminates (3L-FCCL), epoxy resin electronic potting adhesives, label adhesives, FFC insulating films (also known as FFC films, hot melt adhesive films, heat sealing films, heat pressing films), FFC reinforcement boards, electronic tapes, RCC, and epoxy resin-based printed circuit boards (PCB) in high-end applications where stringent requirements for halogen-free flame retardancy, electrical performance, lead-free soldering resistance, solvent resistance, hydrolysis resistance (Anti-hydrolysis), and non-migration are needed.
YS-F22B can be added alone or used in combination with other halogen-free flame retardants (such as Melapur® 200, Melapur® 200Fine, Melapur® 200FF, Dymgard™ PX-230, PX-200, SP-6072B, SP-230H, SP-703, ATH, organosilicon flame retardant FRX-210, phosphorus-containing epoxy resin, etc.) to achieve higher synergistic halogen-free flame retardant effects and superior electrical, mechanical, and thermal performance.
YS-F22B is an ultrafine high dispersion halogen-free flame retardant with excellent high-temperature resistance and solvent resistance. Its ultrafine particle size (D95≤10um) ensures high dispersion performance in various resin and organic solvent systems. Possesses excellent high-temperature resistance with a decomposition temperature exceeding 300℃.
The values listed in the following table are typical values measured by test specification and are for reference only.
III. Product Feature
1. Eco-friendly and halogen-free.
2. High dispersibility, easily dispersible in organic solvents.
3. Excellent electrical and thermal performance.
4. More uniform coating, smoother surface.
5. Solvent resistant, non-migrating
1. YS-F22B is stored in a 25kg paper bag lined with polyethylene.
2. Temperature during storage and transportation should not exceed 80°C.
3. The product should be stored in a dry place at room temperature.
4. When stored under the above conditions, the minimum shelf life is 24 months from the date of shipment.
V. Application
YS-F22B is especially suitable for flexible copper-clad laminates (3L-FCCL), epoxy resin electronic potting adhesives, label adhesives, FFC insulating films (also known as FFC films, hot melt adhesive films, heat sealing films, heat pressing films), FFC reinforcement boards, electronic tapes, RCC, and epoxy resin-based printed circuit boards (PCB) in high-end applications where stringent requirements for halogen-free flame retardancy, electrical performance, lead-free soldering resistance, solvent resistance, hydrolysis resistance (Anti-hydrolysis), and non-migration are needed.
YS-F22B can be added alone or used in combination with other halogen-free flame retardants (such as Melapur® 200, Melapur® 200Fine, Melapur® 200FF, Dymgard™ PX-230, PX-200, SP-6072B, SP-230H, SP-703, ATH, organosilicon flame retardant FRX-210, phosphorus-containing epoxy resin, etc.) to achieve higher synergistic halogen-free flame retardant effects and superior electrical, mechanical, and thermal performance.
